Industry News: thickness after (Page 1 of 8)

IPC Releases Revision A to IPC-2222 Design Standard

Industry News | 2010-12-17 01:47:04.0

IPC has released the A revision of IPC-2222, Sectional Design Standard for Rigid Organic Printed Boards. Helping developers avoid common missteps that reduce board manufacturability, IPC-2222 has been expanded to include more information on board materials, such as relative costs, tolerances of board thickness, unsupported holes, and hole aspect ratios.

Association Connecting Electronics Industries (IPC)

Depaneling Saws for Low Stress PCB Singulation

Industry News | 2020-07-01 12:08:16.0

For high precision low stress PCB singulation of panels with sensitive components near the parting edge, and with the smooth edge finish required by military specifications or by packaging considerations, using a Diamond Blade Saw beats routing for speed and for blade life. The saw blade, a 2.95" (75mm) diameter .021" thick diamond coated cutting disk, provides a low-stress, ultra smooth edge finish for separting panelized Printed Circuit Cards. ts which overhang the parting line will remain intact.

FKN Systek

Different Techniques for Plating

Industry News | 2018-10-18 11:08:03.0

Different Techniques for Plating

Flason Electronic Co.,limited

Raw Material Choices for PCBs

Industry News | 2018-10-18 11:10:33.0

Raw Material Choices for PCBs

Flason Electronic Co.,limited

An Analysis of SMT Solder Paste Printing Defects

Industry News | 2018-10-18 08:27:03.0

An Analysis of SMT Solder Paste Printing Defects

Flason Electronic Co.,limited

IPC Releases New Essential Tools for Industry

Industry News | 2003-07-09 09:11:37.0

Release of the first revision to the standard that forms the foundation of IPC�s family of design standards (IPC-2220)

Association Connecting Electronics Industries (IPC)

Nordson Electronics Solutions introduces new Helios® system for dispensing single-component thermal interface materials

Industry News | 2022-05-05 17:28:46.0

Includes new, easy-to-operate pail pump with unique pail change and loading method, which also reduces material waste

Nordson Electronics Solutions

PCB Design and Layout Guidelines

Industry News | 2018-10-18 11:15:12.0

PCB Design and Layout Guidelines

Flason Electronic Co.,limited

How To Set Profile In SMT Reflow Oven

Industry News | 2018-10-18 09:37:27.0

How To Set Profile In SMT Reflow Oven

Flason Electronic Co.,limited

Printed Circuit Board Solder resist

Industry News | 2018-10-18 10:24:59.0

Printed Circuit Board Solder resist

Flason Electronic Co.,limited

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