Industry News: thickness enig (Page 1 of 1)

STI Acquires Fischerscope X-ray XDAL 237

Industry News | 2017-07-19 21:09:38.0

STI Electronics is pleased to announce the acquisition of a new Fischerscope X-ray XDAL 237 energy dispersive X-ray fluorescence (EDXRF) system.

STI Electronics

Practical Components to Display Its Latest Products at the IPC APEX EXPO

Industry News | 2013-02-04 14:14:48.0

Practical Components and its sister company Practical Tools will exhibit in booth A16 at the upcoming IPC APEX Expo

Practical Components, Inc.

Practical Components Adds Test Board for 0.3 mm Pitch Dummy CVBGA Test Vehicle

Industry News | 2012-01-17 11:05:35.0

Practical Components introduces a test board for its dummy (mechanical sample) version of Amkor’s cutting-edge 0.3 mm pitch CVBGA. Amkor’s new semiconductor device is a wafer-scale package in a miniature package, which is suitable for installation in surface mount technology (SMT). Amkor’s ChipArray® range of packages consists of laminate-based ball grid array (BGA) packages that are compatible with established SMT mounting processes.

Practical Components, Inc.

Practical Components to Debut New Test Board for 0.33 mm Dummy CVBGA Test Vehicle at the IPC APEX Expo

Industry News | 2012-02-03 13:29:38.0

Practical Components will feature its new Amkor PoP stacked packages, including the new TMV PoP, along with its full line of dummy component packages in Booth #538 at the upcoming IPC APEX Expo.

Practical Components, Inc.

Super PCB Offers High-Quality Surface Finishes

Industry News | 2018-11-27 14:03:14.0

Super PCB is pleased to announce that it offers a variety of quality PCB surface finishes. PCB surface finish is the coating between the PCB and components that provides a solderable surface for components and protects the exposed copper circuitry.

Super PCB

Dow Electronic Materials to Showcase Leading Materials for Printed Circuit Board Manufacturing at the IPC APEX EXPO

Industry News | 2011-04-06 13:13:52.0

Dow Electronic Materials will showcase its innovative materials for printed circuit boards (PCBs) at this year’s IPC APEX EXPO. Dow will feature a number of its latest products that are tailored to meet the requirements of increasingly complex circuit boards while delivering ever-higher reliability and consistency. Dow’s next-generation of high quality, cost-effective technologies allow customers to meet future market requirements.

Dow Electronic Materials

  1  

thickness enig searches for Companies, Equipment, Machines, Suppliers & Information

Circuit Board, PCB Assembly & electronics manufacturing service provider

High Precision Fluid Dispensers
Best SMT Reflow Oven

High Throughput Reflow Oven
Void Free Reflow Soldering

Training online, at your facility, or at one of our worldwide training centers"
pressure curing ovens

World's Best Reflow Oven Customizable for Unique Applications
Fully Automatic BGA Rework Station

500+ original new CF081CR CN081CR FEEDER in stock