Industry News: thin film packaging (Page 6 of 76)

What is a HDI PCB?

Industry News | 2018-10-18 11:05:03.0

What is a HDI PCB?

Flason Electronic Co.,limited

Basic Soldering Guide – How to Solder Electronic Components

Industry News | 2018-12-08 03:25:54.0

Basic Soldering Guide – How to Solder Electronic Components

Flason Electronic Co.,limited

IPC Thermal Management Conference Highlights What’s Cool in Today’s Technologies and Materials

Industry News | 2010-09-22 15:01:40.0

Removing heat has become a major issue in the electronics industry as more highly integrated devices are jammed into less space and as high power devices, such as LEDs, become increasingly more common.

Association Connecting Electronics Industries (IPC)

Embedded Component Technology on the Rise Joint IPC/FED Event to Address Critical Technology and Business Issues

Industry News | 2013-05-06 18:48:35.0

IPC – Association Connecting Electronics Industries® announces an ambitious technical agenda for the IPC/FED Conference on Embedded Components.

Association Connecting Electronics Industries (IPC)

IPC Rallies Electronics Industry Members to Contact Their Elected Officials About U.S. Tech R&D Bill

Industry News | 2021-09-30 16:20:50.0

IPC is calling on the U.S. electronics manufacturing community to contact members of Congress about a bill that would boost investment in federal research and development (R&D) in 10 high-tech fields. We hope your media organization will help us publicize this effort.

Association Connecting Electronics Industries (IPC)

How Electronic / Electrical Circuit Works

Industry News | 2018-12-08 03:33:27.0

How Electronic / Electrical Circuit Works

Flason Electronic Co.,limited

How To Set Profile In SMT Reflow Oven

Industry News | 2018-10-18 09:37:27.0

How To Set Profile In SMT Reflow Oven

Flason Electronic Co.,limited

How Semiconductor Works

Industry News | 2018-12-08 03:18:56.0

How Semiconductor Works

Flason Electronic Co.,limited

Super Thin Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

Industry News | 2017-12-05 14:37:56.0

Engineered Material Systems announces the availability of 5 µm thick dry-film negative photoresists for use in micro-electro mechanical systems (MEMS), wafer level packaging and CMOS applications (metallization). This material formulation has been optimized for hot roll or vacuum lamination and processing on MEMS and IC wafers.

Engineered Materials Systems, Inc.

Amkor ULTRA CSP� Test Die

Industry News | 2002-09-17 15:09:18.0

Practical Dummy Components

Practical Components, Inc.


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