Industry News: thin film packaging (Page 7 of 85)

Aspocomp EMS chooses DDE�s Supermax ECAD

Industry News | 2002-05-23 05:38:08.0

Thick Film Hybrid Design Tool for the Future

DDE USA, Inc.

Techcon Systems' Steve Collier to Present at DELO Seminar on UV Adhesives in Eindhoven in May

Industry News | 2009-05-04 16:17:50.0

May 2009 � Techcon Systems, a leading global supplier of fluid dispensing systems and accessories, announces that it will present at the DELO Seminar on UV Adhesives in Eindhoven on the 6th May 2009. Techcon Systems' European Sales Manager for the OEM Division, Steve Collier, will present a paper on best practice dispensing of UV cure adhesives using precision dispensing systems.

Techcon Systems

DEK and CHAD to Demonstrate Enhanced Thin Wafer Capabilities at Semicon West

Industry News | 2009-06-23 20:26:31.0

Debuting its most recent technology advance, mass imaging leader DEK will showcase the company’s new thin wafer processing expertise from booth #811 at the upcoming Semicon West event in San Francisco, California. A full line solution that incorporates a Galaxy Thin Wafer System and a next-generation CHAD WaferMate™ wafer handler, this latest development resolves traditional challenges associated with high-speed handling and processing of thinned wafers on a proven print platform.

ASM Assembly Systems (DEK)

BTU International Appoints Frank Bottari as Director of Solar Applications

Industry News | 2008-08-26 16:35:28.0

NORTH BILLERICA, Mass., Aug. 26, 2008�BTU International, Inc. (Nasdaq: BTUI), a leading supplier of advanced thermal processing equipment for the alternative energy and electronics manufacturing markets, today announced the appointment of Frank Bottari, Ph.D., as director of solar applications.

BTU International

BTU International to Exhibit at Solar Power International 2008

Industry News | 2008-10-13 01:25:05.0

NORTH BILLERICA, Mass., Oct. 9, 2008�BTU International, Inc. (Nasdaq: BTUI), a leading supplier of advanced thermal processing equipment for the alternative energy and electronics manufacturing markets, today announced that it will exhibit in booth 1828 at the upcoming Solar Power International Exhibition and Conference in San Diego. The exhibition is being held on October 13-16.

BTU International

Sono-Tek to Demonstrate SPT200 Photoresist Coating at SEMICON West 2024

Industry News | 2024-06-17 12:25:09.0

Sono-Tek Corporation (Nasdaq: SOTK) is excited to announce its participation in SEMICON West 2024, taking place July 9-11 in San Francisco, CA. Visit the company at booth 6186 to explore advanced ultrasonic coating solutions designed for precision and efficiency in semiconductor manufacturing.

SONO-TEK CORPORATION

A-Laser Specializes in Cutting Ultra Thin Films

Industry News | 2010-01-22 20:49:53.0

BEAVERTON, OR — January 2010 — A-Laser, a division of FCT Assembly and a premier laser cutting service specializing in the ablation of ultra-thin metals and plastics, specializes in cutting ultra thin films, such as Kapton, Cirlex and PEEK, or ultra thin metal foils.

FCT ASSEMBLY, INC.

Draper Chooses Universal's Versatile GenesisSC Platform

Industry News | 2010-05-20 15:25:16.0

Draper Laboratory, Cambridge, Massachusetts – a research and development laboratory engaged in a broad array of programs for government and commercial sponsors – has selected Universal Instruments’ newly released GenesisSC Platform to be utilized in a wide range of assembly requirements.

Universal Instruments Corporation

ANDA Awarded for iCoat-6 High Precision Selective Conformal Coating System

Industry News | 2020-10-04 05:29:56.0

Anda Technologies announces that it was awarded a 2020 GLOBAL Technology Award in the category of Conformal Coating for its iCoat-6 High Precision Selective Conformal Coating. The award was announced during a Virtual Awards Ceremony on Tuesday, Sept. 29, 2020.

Anda Automation Pte Ltd

AI Technology, Inc (AIT) To Attend and Present Paper at IWLPC. AIT also attending IPC/SMTA High-Reliability Cleaning and Conformal Coating Conference.

Industry News | 2014-11-07 10:35:14.0

AI Technology is proud to announce that it will be attending two conferences this November. The first conference AIT will be attending is the International Wafer-Level Packaging Conference (IWLPC), November 11-12 at the Double Tree Hotel in San Jose, CA. This year, AIT's own Dr. Frederick Lo will be presenting his paper, Recent Advances in Die Attach Film.

AI Technology, Inc. (AIT)


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