Industry News | 2012-07-23 11:57:49.0
International Photovoltaic Equipment Association (IPVEA) announces that it has expanded its remit to help its members explore opportunities in energy storage.
Industry News | 2015-12-01 11:54:37.0
Indium Corporation was presented with the Global Technology Award for Best Products - Americas for InFORMS® high-reliability solder preforms, on Nov. 10 at Productronica in Munich, Germany.
Industry News | 2011-06-13 17:16:24.0
Sono-Tek Corporation will highlight the ExactaCoat Tabletop Coating System in Booth #2631 in the South Hall at the upcoming SEMICON West, scheduled to take place July 12-14, 2011 at the Moscone Center in San Francisco, CA.
Industry News | 2021-02-12 16:05:56.0
PVA will showcase the FCS300-ES Ultra Fine Extended Spray Valve during the 2021 IPC APEX Virtual EXPO, scheduled to take place March 9-11, 2021 online at www.ipcapexexpo.org. The valve will be featured on PVA's Delta 6 and Delta 8 selective coating platforms.
Industry News | 2010-07-16 14:59:02.0
Indium Corporation’s Vice President of Technology, Dr. Ning-Cheng Lee, was recognized with the IEEE’s Components, Packaging, and Manufacturing Technology Society (CPMT) Electronics Manufacturing Technology Award in acknowledgement of his contributions to electronics manufacturing technology.
Industry News | 2014-03-07 14:53:11.0
Indium Corporation's Maria Durham, product specialist for semiconductor and advanced assembly materials, will present at the IMAPS Device Packaging conference on Tuesday, March 11 in Scottsdale, Arizona.
Industry News | 2014-05-13 17:01:55.0
Indium Corporation's Graham Wilson, applications engineer, will present at Brasage in Brest, France on Friday, May 23. Wilson's presentation, Elimination of Head-in-Pillow in PoP Assembly: A Flux Approach, discusses eliminating head-in-pillow defects in the package-on-package (PoP) assembly process by engineering unique attributes of the flux chemistries of dipping fluxes and pastes.
Industry News | 2016-03-03 10:33:15.0
Indium Corporation's Sze Pei Lim, Semiconductor Product Manager for Asia, will present at SEMICON China. Lim's presentation, No-Clean Material for Advanced Packaging Assembly, will detail how semiconductor-grade, ultra-low residue, no-clean fluxes and solder pastes eliminate the need for multiple cleaning steps in the system-in-package (SiP) assembly process.
Industry News | 2016-03-17 14:24:23.0
Indium Corporation's Dr. Ning-Cheng Lee, Vice President of Technology, will present a two-part workshop at SMT Hybrid Packaging 2016, on April 26-28 in Nuremberg, Germany.
Industry News | 2016-08-30 14:34:00.0
Indium Corporation experts will deliver several technical presentations at the 37th International Electronics Manufacturing Technology and 18th Electronics Material & Packaging Conference (IEMT-EMAP 2016), Sept. 20-22, in Penang, Malaysia.
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