Industry News: tilt bottom end termination (Page 1 of 3)

IPC & SMTA’s High-Reliability Cleaning & Conformal Coating Conference Continues with a Presentation Dedicated to Reliability & Ruggedness

Industry News | 2016-09-15 18:08:04.0

Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference, scheduled to take place October 25-27, 2016 at Hyatt Rosemont, Rosemont, Illinois. The conference is focused on best practices for designing, cleaning and coating highly dense electronic assemblies to assure reliability in today’s mobile society.

Association Connecting Electronics Industries (IPC)

Session 6 Agenda Is Finalized for the High-Rel Cleaning and Coating Conference Hosted by IPC and SMTA

Industry News | 2012-11-07 11:01:55.0

IPC and SMTA jointly announce the agenda for Session 6 of the High-Reliability Cleaning and Coating Conference, scheduled to take place November 13-15, 2012 at the Crowne Plaza Hotel – O’Hare in Chicago, IL.

Association Connecting Electronics Industries (IPC)

SMTA Europe's Harsh Environments Conference Session 3 to Focus on Advanced Test

Industry News | 2018-04-11 20:04:01.0

SMTA Europe announces Session 3 Technical Program on Advanced Test Methods at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.

Surface Mount Technology Association (SMTA)

SMTA China and Hong Kong Chapter Announce 2011 Best Paper/Presentation and Best Exhibit Awards

Industry News | 2011-09-06 15:20:36.0

SMTA China announced the Best Paper/Presentation and Best Exhibit Awards at its annual awards presentation held in conjunction with SMTA China and Hong Kong Chapter Breakfast Reception, which took place August 31, 2011 at the Ritz-Carlton Hotel in Shenzhen.

Surface Mount Technology Association (SMTA)

SMTA Intermountain Chapter to Hold Annual Technical Symposium

Industry News | 2013-09-10 12:18:26.0

The Surface Mount Technology Association (SMTA)'s Intermountain Chapter will hold its annual technical symposium on September 19 at the University of Utah in the Warnock Engineering Building, Salt Lake City, Utah.

Surface Mount Technology Association (SMTA)

Akrometrix Announces Automated Die Attach Tilt Metrology

Industry News | 2016-02-25 08:45:46.0

Akrometrix today announced that it has developed an automated die-board (or daughter-mother board) attach tilt metrology. All Akrometrix shadow moiré or DFP systems (AXPs) can be upgraded with the new feature.

Akrometrix

New Yorker Electronics releases AC Harmonic Filter Capacitors with Dual Failsafe Protection Systems

Industry News | 2021-10-29 17:35:29.0

New Cornell Dubilier Electronics Capacitor Series is rated at 6,000 hours; new Patented Design Safely Expands Mounting Options

New Yorker Electronics

Saline Lectronics to Install Factory-wide Traceability from Cogiscan

Industry News | 2013-12-03 15:52:18.0

Saline Lectronics, Inc.announces that it has purchased Cogiscan’s Track, Trace and Control (TTC) system.

Saline Lectronics, Inc

Plan your engineering process improvement with a monthly online webinar

Industry News | 2017-04-13 06:06:32.0

Solderability Benchmarking, Failures & Testing Methods 14th August All our webinars are based on 2.30pm UK time go to https://www.bobwillis.co.uk/events/ Benchmarking you PCB surface finish or the impact of baking boards or components can be simple in production and the laboratoy. Long term solderability of component terminations and printed circuit boards is fundamental in modern assembly processes. This is all practical experience not just theory for the presenters countless studies in industry

ASKbobwillis.com

Vi TECHNOLOGY launches the REVEAL Imager AOI Series, a breakthrough inspection solution for the Camera Modules manufacturing industry at SEMICON West 2010, booth 5377

Industry News | 2010-07-09 13:02:47.0

Vi TECHNOLOGY introduces the REVEAL Imager Series, at SEMICON West 2010 from July 13th to 15th, Booth 5377 - North Hall – San Francisco Moscone Center. Along with the product an automatic JEDEC Tray loader compatible with both REVEAL Imager and REVEAL MEMS Series will be demonstrated.

Vi TECHNOLOGY

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