Industry News: tin thickness (Page 1 of 5)

Six IPC APEX EXPO Exhibiting Companies Earn 2020 Innovation Awards

Industry News | 2020-01-29 07:33:26.0

IPC announces the winners of the IPC APEX EXPO 2020 Innovation Awards, a celebration of the innovators who are changing the technological landscape of the electronics industry.

Association Connecting Electronics Industries (IPC)

SN100CL Minimum Thickness Guidelines

Industry News | 2008-09-10 09:31:07.0

Saturn Electronics Corp. Providing Criteria for the Industry

Saturn Electronics Corporation

FCT Assembly Implements High-Performance Spark OES Technology

Industry News | 2008-03-25 21:12:57.0

GREELEY, CO � March 25, 2008 � FCT Assembly announces the acquisition of a Spark OES Analyzer (Optical Emission Spectroscopy) to its analytical lab, which is located in Greeley, Colo. The OES analyzer is one of the most advanced pieces of equipment of its kind available to the market today. FCTA purchased the state-of-the-art equipment to serve as the primary analyzer for all EMS and PC-Fab customer solder analysis, especially those that are lead-free.

FCT ASSEMBLY, INC.

Minimum Thickness PCB

Industry News | 2018-10-18 10:56:54.0

Minimum Thickness PCB

Flason Electronic Co.,limited

Circuit Technology Center Commissions New XRF X-ray System

Industry News | 2021-08-13 08:37:00.0

Circuit Technology Center announces that it has recently purchased and commissioned an Oxford 980 X-Strata series XRF (x-ray fluorescence) system to support the testing of electronic components for restricted substances such as lead or tin above specified limits. The system can also verify the coating thickness. Defense base customers often require XRF verification testing of components after components have been processed through lead-free to leaded solder alloy exchange for tin mitigation applications. XRF testing may also be required to verify RoHS compliance of components that have been re-balled or re-processed for lead-free applications. In addition to XRF testing, Circuit Technology Center also supports ionic cleanliness testing, X-ray, Acoustic Microscopy, Solderability, and BGA ball shear testing services.

Circuit Technology Center, Inc.

Different Techniques for Plating

Industry News | 2018-10-18 11:08:03.0

Different Techniques for Plating

Flason Electronic Co.,limited

Christopher Associates' Jasbir Bath to Chair Reflow Assembly Session at IPC APEX EXPO

Industry News | 2011-03-14 17:53:00.0

Christopher Associates announces that Jasbir Bath, Consulting Engineer, will Chair the session titled "Reflow Assembly" at the upcoming IPC APEX EXPO, scheduled to take place April 12-14, 2011 at the Mandalay Bay Resort & Convention Center in Las Vegas. The session will take place Tuesday, April 12, 2011 from 1:30-3 p.m.

Christopher Associates Inc.

New Yorker Electronics Releases new PDI Power Entry Connector Receptacle

Industry News | 2021-09-27 11:34:09.0

Ganged Female Socket Snap-In Connectors are designed for Rugged Applications in a Compact Space

New Yorker Electronics

Indium Corporation Wins Global Technology Award for InFORMS®

Industry News | 2015-12-01 11:54:37.0

Indium Corporation was presented with the Global Technology Award for Best Products - Americas for InFORMS® high-reliability solder preforms, on Nov. 10 at Productronica in Munich, Germany.

Indium Corporation

STI Acquires Fischerscope X-ray XDAL 237

Industry News | 2017-07-19 21:09:38.0

STI Electronics is pleased to announce the acquisition of a new Fischerscope X-ray XDAL 237 energy dispersive X-ray fluorescence (EDXRF) system.

STI Electronics

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