Industry News: tin vs gold finish (Page 1 of 5)

Flex Circuits Can Be Supplied With Connectors

Industry News | 2003-04-09 08:25:50.0

A new design guide is available from Genalog detailing Samtec's flex circuit capabilities.

SMTnet

Industry Buzzing Over New Free Sessions at IPC APEX EXPO™

Industry News | 2011-03-11 17:28:15.0

Very few attendees can — or even try — to take advantage of all of the resources on-site at IPC APEX EXPO, taking place April 12–14, 2011 in Las Vegas. To optimize their time at the event, visitors can get even more questions answered at free educational "BUZZ Sessions" taking place on the show floor. Panelists at these interactive discussion forums will discuss many of the topics keeping the electronics manufacturing industry buzzing.

Association Connecting Electronics Industries (IPC)

Webtorial: Design and Assembly Process Challenges for Bottom Terminations Components (BTCs) such as QFN, DFN and MLF in Tin-Lead & Lead Free World

Industry News | 2013-01-02 16:01:34.0

A Convenienient and informative online tutorial about Design and Assembly Process Challenges for Bottom Terminations Components

Surface Mount Technology Association (SMTA)

IPC Electronics Assembly Conference in Budapest Offers Critical Information on Quality and Reliability

Industry News | 2010-08-31 12:11:44.0

Eastern Europe's growing electronics assembly industry faces new challenges, especially with the adoption of lead-free technology. To connect manufacturers with solutions to these challenges, IPC — Association Connecting Electronics Industries® is holding the IPC Electronics Assembly Quality & Reliability Conference in Budapest, Hungary on 6­–7 October, 2010.

Association Connecting Electronics Industries (IPC)

IPC Honors Best Technical Papers At IPC Apex Expo 2011

Industry News | 2011-04-20 21:19:17.0

IPC – Association Connecting Electronics Industries® has announced the winners of this year's Best U.S. and International Papers at IPC APEX EXPO™, held April 12–14, 2011, in Las Vegas. The event's Technical Program Committee selected the winners through a ballot process.

Association Connecting Electronics Industries (IPC)

Updates in IPC-6018B Help Engineers Design High-reliability Boards Specification addresses growing field of microwave technology

Industry News | 2012-05-04 09:21:15.0

As printed boards evolve and chip speeds increase, the use of microwave technology in commercial applications, such as cell phone towers and in military products, is expanding.

Association Connecting Electronics Industries (IPC)

IPC Delivers New Standard on Handling, Packaging and Storage of Printed Boards

Industry News | 2010-09-13 15:36:15.0

IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.

Association Connecting Electronics Industries (IPC)

Immersion gold VS Plating gold

Industry News | 2019-05-16 01:27:23.0

There are several surface treatment for PCB board: bare board (no treatment on the surface), rosin board, OSP (Organic Solderability Preservatives), HASL (lead tin, lead-free tin), plating gold, immersion gold, etc., these are relatively conscious treatment. Many people can't tell the difference between plating gold and immersion gold, thinking that it is the same thing, it is a big mistake. The following is a brief introduction to the difference between plating gold and immersion gold.

Headpcb

Solder Tinned Pads vs Gold Plated Pads - The Importance of Selecting the Proper Surface Finish

Industry News | 2018-10-18 10:16:53.0

Solder Tinned Pads vs Gold Plated Pads - The Importance of Selecting the Proper Surface Finish

Flason Electronic Co.,limited

Hentec Industries/RPS Publishes an Engineer's Guide to Component Re-Conditioning Process

Industry News | 2021-04-13 17:37:07.0

Gold plating dissolves rapidly during soldering and can result in gold embrittlement. This tech paper examines how to re-condition electronic components prior to soldering.

Hentec Industries, Inc. (RPS Automation)

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