Industry News: too much solder on bga (Page 1 of 1)

IPC Delivers New Standard on Handling, Packaging and Storage of Printed Boards

Industry News | 2010-09-13 15:36:15.0

IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.

Association Connecting Electronics Industries (IPC)

How to Prevent Solder Joint Voiding and Cold Solder Defects during the SMT Reflow Process

Industry News | 2018-10-18 08:17:09.0

How to Prevent Solder Joint Voiding and Cold Solder Defects during the SMT Reflow Process

Flason Electronic Co.,limited

Webtorial: Design and Assembly Process Challenges for Bottom Terminations Components (BTCs) such as QFN, DFN and MLF in Tin-Lead & Lead Free World

Industry News | 2013-01-02 16:01:34.0

A Convenienient and informative online tutorial about Design and Assembly Process Challenges for Bottom Terminations Components

Surface Mount Technology Association (SMTA)

Practical Components Offers Dummy Triple Stack Package on Package

Industry News | 2008-05-23 18:09:23.0

LOS ALAMITOS, CA � May 20, 2008 � Practical Components Inc., the leading supplier of dummy components, announces the availability of a dummy version of the Amkor� middle stacked package that makes a Triple Stack PoP package (PSvfBGA).

Practical Components, Inc.

Congrats Successful End on Asia Nepcon 2019- The Biggest SMT/EMS Industry Event

Industry News | 2019-09-03 22:19:17.0

The biggest Asian Electronics Events "Nepcon Asia 2019" was closed last Friday, thank you all the professionals to visit our Unicomp booth to deeply discuss the new features of X-ray technologies for BGA soldering inspection as well as SMD Chip counting application.

Unicomp Technology Co., Ltd

Practical Components Offers Amkor TMV® PoP (Package on Package) Daisy Chain Components

Industry News | 2011-01-05 17:46:58.0

Practical Components Inc. announced the availability of daisy chain samples of Amkor Technology, Inc.’s TMV® PoP (Package on Package) solution.

Practical Components, Inc.

SMART Group Hosts Successful “Back to Basics” Rework & Inspection Workshop

Industry News | 2013-04-03 18:52:22.0

SMART Group,announces that on 26th March 2013, more than 30 delegates from manufacturing and service repair sectors, including line managers, process and quality engineers, attended its successful “Back to Basics” Hands-on Rework and Inspection Workshop at the Manufacturing Technology Centre in Coventry, UK

The SMART Group

What's usage of Via tenting for PCB design?

Industry News | 2019-11-05 22:07:01.0

Tenting a via refers to covering via with soldermask to enclose or skin over the opening. A via is a hole drilled into the PCB that allows multiple layers on the PCB to be connected to each other. A non tented via is just a via that is not covered with the soldermask layer. Leaving these vias exposed or covered has pros and cons depending on the your design and manufacturing requirements.

Headpcb

  1  

too much solder on bga searches for Companies, Equipment, Machines, Suppliers & Information

Count On Tools, Inc.
Count On Tools, Inc.

COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.

Manufacturer

2481 Hilton Drive
Gainesville, GA USA

Phone: (770) 538-0411

December 2024 Auction

High Precision Fluid Dispensers
convection smt reflow ovens

High Throughput Reflow Oven
Thermal Interface Material Dispensing

Best Reflow Oven
SMT feeders

World's Best Reflow Oven Customizable for Unique Applications


Original SMT Feeders and spares for Panasonic, Fuji , Yamaha, Juki , Samsung