Industry News | 2017-11-10 17:31:23.0
Techcon today announced plans to exhibit in Hall A2, Stand 135 at productronica 2017, scheduled to take place Nov. 14 – 17, 2017 at the Messe München in Germany. Following the company’s new brand launch, company representatives will demonstrate several new products, including the TSM50BP Meter Mix, TS8100 series Positive Displacement Pump, TSR2000 Smart Dispensing Robot and TS560R Smart Spray Valve Controller.
Industry News | 2018-01-28 19:43:32.0
Techcon today announced that it will showcase several new products, including the TSR2000 Smart Dispensing Robot, TS560R Smart Spray Valve Controller, TSM50BP Meter Mix and TS8100 series Positive Displacement Pump in booth 3063 at the MD&M West 2018 exhibition, scheduled to take place February 6-8 at the Anaheim Convention Center in CA.
Industry News | 2018-08-09 12:24:23.0
Seika Machinery is pleased to announce that it carries six new process control devices from MALCOM and UNITECH. These include: SPS series paste mixers, viscometers, wetting balance testers, profilers / camera systems, reflow simulators and PCB board cleaners.
Industry News | 2001-03-27 08:27:29.0
Tyco Electronics today announced the release of the AMP PT70 connector, a 70-pin board-mounted card edge connector that will connect the new 10-Gigabit Ethernet pluggable fiber optic transceivers to the printed circuit board. The AMP connector's electrical input/output interface is based on XAUI (10G Attachment Unit Interface) protocols.
Industry News | 2021-08-02 14:05:26.0
New Yorker Electronics supplies Cornell Dubilier CDE BLH Series DC Link Capacitors for Long Life, High Power Density and Low ESR Designed for Harsh Environments
Industry News | 2024-11-04 15:25:58.0
Altus Group has seen an increasing interest in laser depaneling systems from LPKF in 2024. Laser depaneling is an advanced method for separating PCBs from their panels using precise laser cutting technology. This innovative process offers significant benefits in efficiency and versatility, making it increasingly relevant across various manufacturing sectors.
Industry News | 2018-05-14 09:06:17.0
Under the slogan “True 3D Smart Factory solutions powered by the AI platform,” Koh Young Technology will exhibit in Hall 4A, Booth 233, at the upcoming SMT Hybrid Packaging show scheduled for June 5-7, 2018 at the Messe in Nuremberg, Germany. The company will display the next-generation Zenith2 3D AOI, new KY-P3 3D pin inspection solution, and the new automated solder dispensing feature on its KY8030-3 3D SPI.
Industry News | 2018-05-14 09:06:21.0
Under the slogan “True 3D Smart Factory solutions powered by the AI platform,” Koh Young Technology will exhibit in Hall 4A, Booth 233, at the upcoming SMT Hybrid Packaging show scheduled for June 5-7, 2018 at the Messe in Nuremberg, Germany. The company will display the next-generation Zenith2 3D AOI, new KY-P3 3D pin inspection solution, and the new automated solder dispensing feature on its KY8030-3 3D SPI.
Industry News | 2014-03-20 10:03:43.0
ADLINK Technology announced an array of new products in various form factors based on the latest Intel® Atom™ and Celeron® processors for intelligent systems, featuring a significant performance per watt improvement over previous generations, high integration of both low speed and high speed IO’s, an advanced graphics engine, and virtualization support - all on a sub-10-watt system-on-chip (SoC) that enables small, light, and reliable embedded designs.
Industry News | 2012-11-06 11:22:15.0
Dispensing and MID (Molded Interconnected Devices) technologies are developing rapidly. Current technology drivers are LED and communication products. On September 28th, Essemtec’s technology day focused on new developments and future challenges. The event was free of charge for all participants.
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