Industry News | 2009-02-27 21:12:43.0
HOUSTON � February 2009 � BPM announces that it will feature the 3000FS Flash Memory Programmer in Hall 7 Booth # D-120 in distributor Esman's booth at the upcoming Electrotech 2009, scheduled to take place February 26-March 1, 2009 in Istanbul, Turkey.
Industry News | 2009-09-18 10:24:30.0
Tempe, AZ - FINETECH will exhibit the FINEPLACER® CRS 10 rework system in booth 322 at the upcoming SMTA International, scheduled for October 6-7, 2009 at The Town and Country Resort and Convention Center in San Diego, CA. The system will demostrate rework of 0201 passives, BGA‘s, and QFN devices, as well as residual solder removal.
Industry News | 2010-01-28 11:44:36.0
HOUSTON — January 21, 2010 — BPM Microsystems announces the retirement of Lyman Brown, executive vice president and chief operating officer, effective January 31, 2010. William White will transition back into the role of president and chief executive officer.
Industry News | 2012-05-30 13:50:20.0
Hesse & Knipps GmbH will discuss “Wedge Bonding for Chip-On-Board and Direct-Chip-Attach Applications” at the SMTA Philadelphia Chapter Meeting.
Industry News | 2017-11-09 14:55:51.0
BPM Microsystems is demonstrating its new 4900 automated programming system at Productronica. The 4900, with its advanced chip-scale part (CSP) device handling, on-the-fly vision alignment, and HS400 programming speeds, satisfies a vast range of programming needs in one automated system. Featuring high-performance laser marking and 3D inspection, the 4900 provides advanced serialization and quality control, meeting the highest programming and cyber security standards for automotive, aerospace, medical, industrial and mobile device industries.
Industry News | 2008-08-01 00:29:58.0
With the well-respected die attach brands of Hysol� and Ablestik�, Henkel has long been recognized for consistently pushing the bar higher when it comes to advanced semiconductor materials development. This pioneering philosophy has led to the development of yet another groundbreaking materials advance and the launch of Henkel's Ablestik 8000� Wafer Backside Coating� (WBC) technology.
Industry News | 2012-05-11 20:19:04.0
Hesse & Knipps, Inc., the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH, will discuss "Large Diameter Wedge Bonding of Round and Ribbon Wire for Automotive Applications" during IMAPS 3rd Advanced Technology Workshop and Tabletop Exhibition on Automotive Microelectronics and Packaging, taking place at the Dearborn Hotel in Dearborn, Michigan May 22-24, 2012.
Industry News | 2009-12-07 18:08:56.0
Data I/O Corporation (NASDAQ: DAIO), the provider of manual and automated device programming solutions, today announced plans to debut its new FlashCORE III programming architecture at Productronica in Hall A2, Stand 329. This new technology will be at the core of every product to be highlighted at this key industry event, scheduled to take place 10th – 13th November at the Munich Trade Fair Center in Munich, Germany.
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