Industry News | 2003-03-20 08:12:57.0
Nichicon has increased the top capacitance value of its WG series of surface mount electrolytic capacitors from 1000 to 1500uF.
Industry News | 2015-12-01 10:49:39.0
Baja Bid will be conducting a year-end online auction and assisting several customers in liquidating some of their excess and unused assets. The bidding for this event will open promptly at 8:00am EST on December 7, 2015 and the closing will begin at 11:00am EST on December 9, 2015.
Industry News | 2019-01-12 07:42:28.0
IPC – Association Connecting Electronics Industries® announces the winners of the IPC APEX EXPO 2019 Innovation Awards, a celebration of the innovators and forward thinkers who are changing the technological landscape of the electronics industry.
Industry News | 2022-08-16 16:11:50.0
YINCAE is excited to announce that we have developed UF 158HA that is fully compatible with flux residue and high performance underfill. Using UF 158HA can eliminate cleaning process and pollution from the cleaning process, and simplify the manufacturing process.
Industry News | 2011-02-24 21:33:45.0
JEDEC Solid State Technology Association today announced the publication of its next-generation storage system standard, Universal Flash Storage (UFS). UFS is designed to be the most advanced specification for both embedded and removable flash memory-based storage in mobile devices such as smart phones and tablet computers.
Industry News | 2020-11-06 17:31:29.0
Data I/O Corporation (NASDAQ: DAIO) received a 2020 GLOBAL Technology Award in the category of Device Programming for its Single Socket UFS Upgrade Kit for Lumen®X. The award was announced during a Virtual Awards Ceremony on Tuesday, Sept. 29, 2020.
Industry News | 2025-02-03 20:13:31.0
YINCAE has introduced UF 120LA, a high-purity liquid epoxy underfill engineered for advanced electronics packaging. With exceptional flowability into 20μ gaps, UF 120LA eliminates cleaning processes, reducing costs and environmental impact while ensuring superior performance across applications like BGA, flip chip, WLCSP, and multi-chip modules.
Industry News | 2017-11-01 15:15:49.0
Data I/O Corporation will demonstrate UFS device programming for automotive applications on the LumenX™ programming platform at the international productronica trade show November 14th – 17th in Munich, Germany at Hall A2, Booth 205.
Industry News | 2018-03-20 13:50:47.0
Data I/O Corporation will showcase its award-winning UFS device programming technology on the Lumen™X in Booth #1A32 at NEPCON China, scheduled to take place April 24th – 26th at the Shanghai World Expo Exhibition & Convention Center.
Industry News | 2018-01-17 10:25:54.0
Data I/O Corporation (NASDAQ: DAIO), the leading global provider of advanced data and security programming solutions for flash, flash-memory based intelligent devices and microcontrollers, partners with leading flash memory suppliers to enable support for high-performance Universal Flash Storage (UFS) devices on the LumenX programming platform. UFS is the next generation Flash memory used in the latest automotive designs to support the projected growth in programmable content from 32GB to over 1 TB and beyond by 2025; driven primarily by infotainment systems in connected and autonomous cars. The LumenX programming platform is architected to deliver the highest programming performance for e-MMC and UFS flash memory today and is extensible to meet projected 10x performance requirements in the future.
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