Industry News: universal and fuzion (Page 12 of 33)

Henkel and Leading Shanghai-Region Academia form Joint Electronics Research and Failure Analysis Center

Industry News | 2008-07-01 15:34:36.0

Committed to promoting electronics material advancement in the burgeoning China region, Henkel and Shanghai University, in conjunction with several leading research universities, have entered into an agreement to form a Shanghai Region Joint Electronics Research and Failure Analysis Center.

Henkel Electronic Materials

Digicom Electronics and CASPER'S Technology Generate Astronomy and Aerospace Innovation and Collaboration, White Paper Available

Industry News | 2018-05-02 20:33:35.0

Digicom Electronics announces that the white paper, Digicom Electronics and CASPER'S Technology Open Endless Possibilities for Astronomy and Aerospace Innovation and Collaboration, is now available on the www.Digicom.org website.

Digicom Electronics

Universal Instruments and Cogiscan join forces to provide Factory-Wide Traceability & Connectivity

Industry News | 2017-01-10 09:21:43.0

Cogiscan announced that it was chosen by Universal Instruments to support traceability and connectivity requirements for one of its major customers. Universal was recently selected by a leading EMS provider to source and supply complete production lines for a new facility. The customer requirement included Universal’s core product offerings for automated pick-and-place in SMT and automated through-hole insertion, as part of a comprehensive factory-wide solution.

Cogiscan Inc.

DEK and Tsinghua Present SMT Scholarships to 15 Outstanding Students

Industry News | 2011-06-22 00:42:59.0

Screen printing market leader, DEK, and Tsinghua Flextronics SMT Laboratory today jointly presented the first group of Tsinghua DEK SMT scholarships. The scholarship program, which started this year, is an industry first in mainland China and has been awarded to 15 outstanding students from Tsinghua University.

ASM Assembly Systems (DEK)

Hover-Davis and Nortec to demonstrate new feeder and identification solutions at SMTAI.

Industry News | 2017-09-13 14:19:50.0

Hover-Davis will be exhibiting its latest feeder and identification solutions in Universal Instruments’ booth # 223 at SMTA International Electronics Exhibition on September 19-20 at the Donald Stephens Convention Center in Rosemont, Illinois near Chicago.

Hover-Davis

Universal Automates Odd Form Component Placement and Final Assembly in One Machine

Industry News | 2001-01-29 14:45:47.0

Addressing the electronics industry's need for a cost-effective odd form placement and final assembly workcell, Universal Instruments Corp. has launched the new Polaris Assembly Cell.

Universal Instruments Corporation

Universal Highlights New Platform and Emerging Market Focus at APEX 2012

Industry News | 2012-02-23 16:51:16.0

Universal Instruments sets a higher standard for versatility and performance in a multifunction surface mount platform with the introduction of the Genesis GX-37D to the Americas market at the APEX 2012. Universal will demonstrate the exceptional capabilities of the GX-37D on booth #2737, as well as share the company’s vision into the exciting new markets shaping the industry landscape and Universal’s unique position as a productivity and profitability leader in these markets.

Universal Instruments Corporation

Anadigm� Names William McLean President and CEO

Industry News | 2002-11-18 11:47:42.0

William McLean, a 20-year veteran of the semiconductor industry and most recently President of U.S. Operations at ParthusCeva, was today named CEO and President of Anadigm�.

Anadigm

Metcal soldering and rework technology at APEX

Industry News | 2019-01-05 16:56:23.0

Metcal today announced plans to exhibit at the 2019 IPC APEX EXPO, scheduled to take place Jan. 29-31, 2019 at the San Diego Convention Center. The company will demonstrate its Connection Validation (CV) Robotic Soldering System, CV Soldering System with new hand-pieces, CV-500 Soldering System and VFX-1000H Volume Fume Extraction System in Booth #1314.

Metcal

JEDEC and IPC Release Tin Whisker Acceptance Testing Standard and Mitigation Practices Guideline

Industry News | 2006-05-04 17:10:10.0

Documents to help manufacturers reduce the risk of tin whiskers in Pb-free products

iNEMI (International Electronics Manufacturing Initiative)


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