Industry News | 2008-03-08 04:04:22.0
OSAKA, JAPAN � March 7, 2008 � Nihon Superior Co. Ltd., a supplier of advanced lead-free soldering materials to the global electronics industry, announces that it is collaborating with the University of Queensland (Australia) in the investigation of the growth and properties of the intermetallic compounds that form between solder alloys and the soldered substrate.
Industry News | 2009-02-13 14:05:18.0
Model 1105 Universal Counter
Industry News | 2019-06-27 17:59:55.0
New design features higher efficiency, 20% lower manufacturing costs
Industry News | 2023-10-09 09:36:36.0
NEOTech is pleased to announce the appointment of Rupinderjit (Rubi) Catuna as Chief Financial Officer.
Industry News | 2009-05-29 13:48:27.0
NORTH BILLERICA, Mass. � (BUSINESS WIRE) � May 29, 2009 � BTU International, Inc. (Nasdaq: BTUI), a leading supplier of advanced thermal processing equipment and processes for the alternative energy and electronics assembly markets, today announced the hiring of Jan-Paul van Maaren, Ph.D., as vice president marketing.
Industry News | 2013-10-15 17:23:57.0
BTU International, Inc. today announced that it joined the Advanced Research in Electronics Assembly (A.R.E.A.) Consortium, established by Universal Instruments’ Advanced Process Laboratory.
Industry News | 2019-05-12 19:27:38.0
Digicom Electronics announces that its Reconfigurable Open Architecture Computing Hardware (ROACH) System (the spectrometer system it builds for worldwide astronomers) was instrumental in collecting the data used to capture the first-ever photo of a black hole. The ROACH System, and Digicom's Diamond Track quality electronics manufacturing services and capabilities, will be on display at Space Tech Expo, Pasadena, CA, May 21 and 22, in booth 4023.
Industry News | 2019-09-02 13:31:41.0
Libra Industries is pleased to announce the promotion of Tom Dykeman to Executive Vice President of Business Development. For the past six years, Dykeman has been instrumental in growing the company as VP of Sales & Business Development.
Industry News | 2020-01-24 14:03:39.0
Hover-Davis will demonstrate its new Radial, Tube and Tray feeders at the 20th IPC Apex Expo. Developed in partnership with Universal Instruments, these innovative feeders solve the packaging challenges of larger SMD and odd-form electronic components such as relays, connectors, capacitors, LEDs, and more. Originally proven on Universal’s Uflex™ and FuzionOF™ automation systems, the company’s new odd-form feeders are now available through Hover-Davis, with interface kits available for a wide range of automation system integration applications.
Industry News | 2008-03-20 20:42:22.0
Several authors from Agilent's Digital Test Division have written chapters about High-Speed Physical Layer Characterization in the new Digital Communications Test and Measurement Handbook, co-edited by Dennis Derickson, California Polytechnic State University and Marcus Mueller, Agilent. The book covers basics, transmitter test, receiver test, and interconnect topics to verify system performance of high-speed digital links.
