Industry News: universal instruments i/o board (Page 11 of 17)

Universal’s GenesisSC: Semiconductor Performance at Surface Mount Speeds

Industry News | 2010-04-12 01:51:10.0

Universal Instruments expands its proven Genesis Platform portfolio with the introduction of the GenesisSC Platform – a revolutionary Semiconductor solution that blends state-of-the-art flip chip assembly capabilities with the robustness and speed of the Genesis Platform.

Universal Instruments Corporation

Anadigm� Launches First Dynamically Programmable Analog Chip Priced Below $5

Industry News | 2003-09-03 11:07:19.0

New AN221E02 Features Full Dynamic Reconfiguration Features, Opens Simple Analog Applications to Platform-Based Solution

Anadigm

JTAG Technologies Targets Functional Testers

Industry News | 2011-09-12 15:45:51.0

JTAG Technologies is pleased to announce the immediate release of a new JTAG/boundary-scan hardware interface product compatible with the MAC-Panel ‘Scout’ mass interconnect system. The JT 2147/DAK is a signal conditioning module that allows seamless connections from JTAG Technologies PXI DataBlaster to the Scout’s connection system.

JTAG Technologies B. V.

ADLINK Introduces its 4-CH 24-bit USB-2405 Dynamic Signal Acquisition Module

Industry News | 2013-07-18 20:34:15.0

ADLINK Technology announces the release of its new four-channel USB 2.0 dynamic signal acquisition module, the USB-2405.

ADLINK Technology, Inc.

Gen3 Systems Announces Product Lineup for Southern Manufacturing

Industry News | 2016-02-02 12:18:54.0

Gen3 Systems Limited is pleased to announce that it will exhibit in Booth E19 at Southern Manufacturing, scheduled to take place Feb. 9-11, 2016 at FIVE in Farnborough, Hampshire.

Gen3 Systems

Universal Instruments’ APL Hosts Initial 2010 AREA Consortium Meeting

Industry News | 2010-07-29 15:10:06.0

Universal Instruments’ Advanced Process Lab hosted the first Advanced Research in Electronics Assembly (AREA) Consortium meeting of 2010 at the Treadway Inn in Owego, NY on June 16-17. Nearly 80 attendees from the 29 member companies participated in the two-day event, which will also be presented in subsequent webcasts. Topics ranged from thermal interface assembly to a continuing analysis of lead-free solder microstructure and reliability.

Universal Instruments Corporation

ADLINK Technology Strengthens European Operations Through Hiring of Former Kontron CTO

Industry News | 2013-05-15 19:28:54.0

ADLINK Technology announced new leadership for its global business unit with the addition of Dirk Finstel as Executive Vice President of MCPS and CEO of ADLINK's European headquarters, Lippert ADLINK Technology GmbH in Mannheim, Germany.

ADLINK Technology, Inc.

BTU Continues Advanced Research in Electronics Assembly

Industry News | 2016-06-15 19:41:50.0

BTU International has renewed its membership in the Advanced Research in Electronics Assembly (AREA) Consortium, established by Universal Instruments’ Advanced Process Laboratory (APL). The state-of-the-art APL currently houses a PYRAMAX™ 100N Reflow Oven with 400°C capability and will soon accept delivery of a PYRAMAX™ 125N Reflow Oven. The 125N features a 24" width process chamber enabling the processing of large boards for LED and other applications.

BTU International

Isola Names Jeff Waters President and CEO Former Altera executive to lead global dielectric material manufacturer.

Industry News | 2016-01-17 10:53:17.0

Isola Group announced today that its board of directors has appointed Jeff Waters as president and CEO, effective immediately. Waters succeeds Interim CEO Jeffery McCreary, who was brought in to enable leadership continuity after Ray Sharpe’s retirement in August 2015. McCreary will continue to serve on Isola’s board of directors, a position he has held since 2006.

Isola Group

Z-AXIS Adds Equipment for Mixed-Technology PCB Assembly in the USA

Industry News | 2021-06-18 13:02:59.0

New equipment for automated insertion of through-hole components increases Z-AXIS' capacity for mixed-technology PCB assembly, supports growing demand for USA contract manufacturing

Z-AXIS, Inc.


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