Industry News | 2003-03-25 09:24:51.0
The Cadstar Universal package enables educational establishments to provide multiple licences of current generation PCB design solutions for students at a cost equivalent to a standard single licence.
Industry News | 2020-04-11 14:25:00.0
Increased capabilities in lab will support increased research and training opportunities in photonic
Industry News | 2003-03-04 08:31:59.0
Ian Suttie To Drive Company's Expansion in Professional Printed Circuit Board Design Market
Industry News | 2011-08-18 14:41:06.0
MIRTEC, “The Global Leader in Inspection Technology,” announced that it will exhibit its award winning MV-3L Desktop AOI machine at the upcoming SMTA Capital Expo & Tech Forum.
Industry News | 2003-03-19 08:25:45.0
Pilot Program Facilitates Information Exchange Standards in Electronics Manufacturing Industry
Industry News | 2003-02-04 08:49:40.0
John Was the Product Manager for Orcad's Schematic Capture and PCB Layout Programs from 1994 to 2001
Industry News | 2003-07-09 09:00:46.0
He will have responsibility for all aspects of Photronics� manufacturing and sales activities in China, Singapore and Taiwan.
Industry News | 2003-05-22 08:54:17.0
Allows PCA Manufacturers to Compare Costs of Alternative Test Strategies
Industry News | 2019-06-26 19:59:58.0
IPC’s Emerging Engineer program provides professionals early in their careers an opportunity to learn from industry mentors about IPC Standards development, and to obtain education and training for professional development. IPC is now actively seeking applications for engineers and mentors for the 2020 Emerging Engineer program.
Industry News | 2009-07-24 14:13:44.0
Minneapolis, MN – The SMTA and MEPTEC are proud to announce the program for their co-organized 2009 Medical Electronics Symposium: Drivers for Technology, Health and the Economy on September 16-17, 2009 at Arizona State University, Tempe, AZ. This two day program will cover a broad spectrum of medical applications with Day 1 focusing primarily on the chip level component packaging and Day 2 focusing on board assembly and systems levels.