Industry News: used wedge bonder (Page 1 of 9)

OneChip Photonics Facility In Canada Closing – All Assets Being Sold

Industry News | 2014-06-03 13:04:15.0

The OneChip Photonics facility in Kanata; Ontario, Canada will be closing their site and all assets are being sold via an online auction. The bidding for the auction will open promptly at 4:00am EST on June 3, 2014 with Lots 1-512 beginning to close at 11am EST on June 4, 2014.

Baja Bid

IPC Announces Winter 2012 Webinar Schedule

Industry News | 2011-12-21 22:41:39.0

Offering convenient and cost-effective staff development, IPC announces its Winter Webinar Series for January, February and March 2012. The one-hour webinars which focus on critical issues facing the industry, offer companies an opportunity to bring IPC technical information to a large number of employees at one time.

Association Connecting Electronics Industries (IPC)

New Technology for Void-free Reflow Soldering

Industry News | 2018-10-18 09:16:42.0

New Technology for Void-free Reflow Soldering

Flason Electronic Co.,limited

Hesse & Knipps, Inc. Opens Second Demo and Applications Lab on West Coast

Industry News | 2012-02-15 20:06:32.0

Hesse & Knipps, Inc., the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH recently opened a West Coast Demo and Applications Laboratory to provide enhanced applications and field support to customers throughout the western region. The Hesse & Knipps Demo and Applications Lab is located at the company’s manufacturer rep - Chalman Technologies - in Anaheim, CA. Hesse & Knipps also maintains an East Coast Demo and Applications Lab in Sterling, MA.

Hesse Mechatronics

Palomar Introduces New Automatic

Industry News | 2003-05-05 09:13:55.0

Reliable Wire Bonders for High Yield Production

Palomar Technologies

Hesse & Knipps To Discuss "Wedge Bonding for Chip-On-Board and Direct-Chip-Attach Applications" at SMTA Philadelphia Chapter Meeting

Industry News | 2012-05-30 13:50:20.0

Hesse & Knipps GmbH will discuss “Wedge Bonding for Chip-On-Board and Direct-Chip-Attach Applications” at the SMTA Philadelphia Chapter Meeting.

Hesse Mechatronics

Hesse & Knipps To Discuss “Large Diameter Wedge Bonding of Round and Ribbon Wire for Automotive Applications” at IMAPS Advanced Technology Workshop

Industry News | 2012-05-11 20:19:04.0

Hesse & Knipps, Inc., the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH, will discuss "Large Diameter Wedge Bonding of Round and Ribbon Wire for Automotive Applications" during IMAPS 3rd Advanced Technology Workshop and Tabletop Exhibition on Automotive Microelectronics and Packaging, taking place at the Dearborn Hotel in Dearborn, Michigan May 22-24, 2012.

Hesse Mechatronics

Hesse Mechatronics Appoints Representative for South America

Industry News | 2014-01-24 16:21:17.0

Hesse Mechatronics has appointed HTMG as the company's sales representative for South America.

Hesse Mechatronics

Hesse & Knipps Appoints Prospect Technical Sales as Rep throughout Northwest United States and Canada

Industry News | 2012-08-02 11:15:11.0

Hesse & Knipps, Inc., (www.hesse-knipps.com) has strengthened its customer support and wedge bonder representation throughout Northwestern United States and Canada with the appointment of Prospect Technical Sales that will now support the company’s family of wedge bonders in Nevada, Oregon, Washington, Montana, Utah, Colorado, Northern California as well as the Canadian provinces of British Columbia and Alberta.

Hesse Mechatronics

Hesse Mechatronics to Demonstrate Wedge Wire Bonding Capabilities at Productronica

Industry News | 2013-10-31 11:53:09.0

Hesse GmbH will demonstrate a full range of wedge wire bonding capabilities at Productronica, taking place November 12-15 in Munich, Germany, in Hall B2, Booth 255.

Hesse Mechatronics

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