Industry News | 2014-07-30 12:10:12.0
Nordson DAGE and Nordson YESTECH, divisions of Nordson Corporation (NASDAQ: NDSN), announce they will exhibit in Booth # A-1H30 at NEPCON South China, scheduled to take place August 26-28, 2014 at the Shenzhen Convention & Exhibition Center in Shenzhen, China.
Industry News | 2022-08-26 09:23:24.0
Nordson TEST & INSPECTION, a division of the Nordson Corporation (Nasdaq: NDSN), will exhibit at the SMTA Guadalajara Expo & Tech Forum, scheduled to take place Sept. 21-22, 2022, at the Expo Guadalajara in Jalisco, Mexico. The Assure™ Pro, Quadra 7, FX-940UV and FX-942 will be on display in the SMarTsol Technologies booth.
Industry News | 2015-08-25 11:15:00.0
Techcon Systems has developed a new disposable material path (DMP) diaphragm valve. The new TS5624DMP valve features a “first to market” disposable material path, enabling difficult fluids and pre-mixed two-part epoxies to be dispensed without the need for frequent cleaning. The entire wetted area can simply be replaced in a matter of seconds, while the valve stays on the production line.
Industry News | 2014-02-26 14:17:03.0
Nordson YESTECH will feature its market leading Automated Optical (AOI) and Automated X-ray Inspection (AXI) systems in Booth #2025 at the upcoming IPC APEX EXPO.
Industry News | 2016-07-30 19:34:22.0
Nordson DAGE and Nordson MATRIX, divisions of Nordson Corporation (NASDAQ: NDSN), will exhibit in Stand 1H20 at NEPCON South China, scheduled to take place Aug. 30-Sept. 1, 2016 at the Shenzhen Convention & Exhibition Centre. Nordson DAGE will showcase its new 4th generation, ultra-high resolution, off-line MXI X-ray system – the Quadra™ 7 and 4000Plus Bondtester. Nordson MATRIX will showcase its high-speed X3 Inline AXI system.
Industry News | 2013-10-25 17:55:58.0
Nordson YESTECH,a subsidiary of Nordson Corporation (Nasdaq: NDSN) will feature the FX SL AOI in Hall A2, Stand 438 at the Productronica International Trade Fair, scheduled to take place November 12 - 15, 2013 at the New Munich Trade Fair Centre in Munich, Germany.
Industry News | 2014-05-06 11:52:11.0
Visitors to the recent National Electronics Week (NEW) exhibition and conference in Birmingham had a unique opportunity to learn about the advantages of conformal coating, which many electronics manufacturers increasingly view as an integral part of their production process. Exhibits including a live production line, and a seminar, revealed how to achieve as much as possible from the technology and how to fully understand the issues involved.
Industry News | 2016-03-27 14:19:07.0
Henkel Adhesive Technologies’ award-winning Technomelt® materials have long been recognized as the industry standard for high-performance low pressure molding applications. Extending the effectiveness of the portfolio outside of proven encapsulation processes, a newly-formulated Technomelt is now also providing a streamlined and economical alternative to conventional masking techniques for various coating requirements.
Industry News | 2003-09-25 13:32:47.0
Reduce waste and cost.
Industry News | 2012-01-13 13:20:53.0
Zymet has introduced a new reworkable underfill encapsulant, CN-1736, designed to underfill 0.4-mm pitch Package-on-Package (POP) assemblies. It has low viscosity and a lower CTE than its predecessors. Plus it has greater flux compatibility, making it suitable for use with a broader range of solderpastes and tacky fluxes.