1 void accepted % for pogo pin result

Multitest’s Solution for 3D Packages Released to Production Electrical test during the assembly process ensures best production yield

Industry News | 2012-07-09 08:11:26.0

Multitest announces that the first Multitest Plug & Yield solution for the test of 3D packages recently has been released to the customer’s production.

Multitest Elektronische Systeme GmbH