Industry News: wafer dicing (Page 1 of 3)

WESTWIND TO SHOWCASE SPINDLES AT SEMICON WEST 2004

Industry News | 2004-06-21 10:03:41.0

Westwind Air Bearings, the World�s leading spindle supplier to the semiconductor industry, is proud to announce its participation at SEMICON West 2004, held at the Moscone Centre, San Francisco, from 12th to 14th July 2004.

Westwind Air Bearings

Orbotech’s SPTS Technologies Accelerates Industry Adoption of its Mosaic Plasma Dicing Solution with Order from JCAP Corporation

Industry News | 2017-03-08 19:49:16.0

ORBOTECH LTD. (NASDAQ: ORBK) today announced that SPTS Technologies, an Orbotech company and a supplier of advanced wafer processing solutions for the global semiconductor and related industries, has won an order for its Mosaic Plasma Dicing System from JCAP Corporation (Jiangyin Changdian Advanced Packaging Co., Ltd), a JCET company and leading Chinese advanced packaging services provider to global semiconductor companies. Orbotech's SPTS also announced that a recent analysis of MEMS microphones in the iPhone 7 Plus conducted by System Plus Consulting[1] confirmed that an ASIC device in the iPhone 7 Plus had been plasma diced.

Orbotech

Microtronic GmbH Partners with Loadpoint to Offer Dicing Service

Industry News | 2013-11-18 16:42:52.0

Microtronic GmbH has entered into a strategic partnership with Loadpoint to offer a dicing and grinding service.

Microtronic GmbH

WALTS CO., LTD. Appoints Practical Components to Be Exclusive Representative for American Market

Industry News | 2015-02-22 17:49:35.0

Practical Components has added the WALTS Co., LTD to its extensive line of Dummy Components and Test Boards. Headquartered in Fukuoka, Japan, WALTS Co., LTD. develops and provides advanced test element group wafers (TEG) die/test kits. Their high-technology wafers are used extensively worldwide in wide ranging applications. WALTS collaborates on research with academic institutes on advanced assembly technologies. WALTS offers film sputtering and deposition, backgrinding, dicing service on test wafer/glass.

Practical Components, Inc.

DEK Galaxy Platform Enables LORD Corporation’s Product Development Initiatives

Industry News | 2009-08-20 15:26:58.0

To progress development of its next-generation pre-applied underfill materials, LORD Corporation has selected DEK’s award-winning Galaxy platform. LORD, a Cary, North Carolina-based leading manufacturer of electronic materials, found the precision, accuracy and process capability of the Galaxy simply unmatched and, therefore, the ideal system to enable its materials innovation initiatives.

ASM Assembly Systems (DEK)

Panasonic Selects Creyr Innovation as Microelectronics Sales Rep

Industry News | 2014-02-04 15:04:31.0

Creyr Innovation has been selected by Panasonic Factory Solutions Company of America as a value-added sales representative for microelectronics solutions in the New England area.

Panasonic Factory Solutions Company of America (PFSA)

Dummy Silicone Grade Wafers

Industry News | 2003-10-30 14:45:33.0

Cost Effective Alternative

Practical Components, Inc.

Full Probe Card Test

Industry News | 2021-07-15 03:55:39.0

The latest fixtureless technology available for production and validation testing the most challenging Probe Cards

SEICA SpA

Cognex Corporation Enters Into $1.3 Million OEM Agreement with Alphasem AG

Industry News | 2002-04-24 08:49:13.0

Alphasem Expects to Purchase Approximately $1.3 Million of Cognex's MVS 8100 Machine Vision Systems Over the Next 18 Months

Cognex Corporation

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