Industry News | 2013-10-08 15:37:23.0
MIRTEC, “The Global Leader in Inspection Technology”, will exhibit its award-winning line of 3D AOI and SPI Inspection Systems in Hall A2, Stand 578 at the Productronica International Trade Fair, scheduled to take place November 12 - 15, 2013 at the New Munich Trade Fair Centre in Munich, Germany.
Industry News | 2011-08-17 12:59:10.0
The SMTA announced that SMTA International will provide updated research on Head-in-Pillow component soldering defects as well as a focused tutorial on the subject. SMTAI will take place October 16-20, 2011 in Ft. Worth, Texas.
Industry News | 2013-01-02 16:01:34.0
A Convenienient and informative online tutorial about Design and Assembly Process Challenges for Bottom Terminations Components
Industry News | 2020-08-22 04:07:55.0
Indium Corporation will host an InSIDER Series webinar on causes and solutions of PCB and component warpage defects, presented by industry consultant Bob Willis. There will be two sessions on Wednesday, Sept. 9--5:30 a.m. Eastern Time (10:30 a.m. London Time, 5:30 p.m. Malaysia Time) and Noon Eastern Time (5 p.m. London Time, Midnight Malaysia Time).
Industry News | 2022-04-13 10:04:24.0
SHENMAO America, Inc. is pleased to introduce its PF735-PQ10-10 Low Melting Point Lead-Free Solder Paste. Low-temperature solder paste has become more widely used in the assembly of surface mount technology devices because certain assemblies cannot withstand the same temperatures that are used for lead-free soldering, typically 240°-250°C. These high temperatures can damage sensitive components, causing warpage and other damage.
Industry News | 2017-08-30 16:58:11.0
Akrometrix will be a panelist in the upcoming SMTAI Spotlight 5 panel discussion, scheduled to take place Wednesday, Sept. 10, 2017 from 2-3 p.m. The discussion, entitled “Warpage Induced Defects and Component Warpage Limits,” will be streamed on Facebook Live.
Industry News | 2023-03-16 14:42:07.0
SHENMAO America, Inc. has released its new Anti-HoP Lead-Free Solder Paste PF606-P130N. The paste is specially designed for the SMT process to prevent head-on-pillow (HoP) issues.
Industry News | 2019-01-10 16:30:44.0
NP505-LT is a no-clean, lead-free, zero-halogen solder paste for assemblies that have temperature sensitive substrates and components.
Industry News | 2019-05-20 18:51:08.0
SHENMAO America, Inc. introduces PF735-PQ10 Low Temperature Solder Paste. Qualified by a third-party organization, the PQ10 series of low temperature solder paste is made with a modified Sn/Bi alloy that has a lower melting point range from 137°~142°C to 137°~170°C. This makes it ideal for SMT devices, which can have sensitive components that cannot withstand higher temperatures.
Industry News | 2009-03-18 14:01:06.0
MORRISVILLE, NC - March 2009 - Juki Corporation, a world-leading provider of automated assembly products and systems, announces that it will premiere the FlexSolder S3532 in booth 759 at the upcoming APEX 2009 exhibition and conference, scheduled to take place March 31-April 2, 2009 in Las Vegas.
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