96 0402 dimension results

SMT Express, Volume 2, Issue No. 4 - from SMTnet.com

Manufacturability & Reliability Challenges with Leadless Near Chip Scale (LNCSP) Packages in Pb-Free Processes

Manufacturability & Reliability Challenges with Leadless Near Chip Scale (LNCSP) Packages in Pb-Free Processes

SMTnet Express - September 2, 2021

SMTnet Express, September 2, 2021, Subscribers: 26,737, Companies: 11,436, Users: 26,825 Tombstoning Of 0402 And 0201 Components: "A Study Examining The Effects Of Various Process And Design Parameters On Ultra-Small Passive Devices

Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints.

SMT Express, Volume 3, Issue No. 11 - from SMTnet.com

SMT Express, Volume 2, Issue No. 4 - from SMTnet.com

SMT Express

SMT Express, Issue No. 3 - from SMTnet.com

SMTnet Express - May 21, 2015

SMTnet Express, May 21, 2015, Subscribers: 22,770, Members: Companies: 14,358, Users: 38,224 Beyond 0402M Placement: Process Considerations for 03015M Microchip Mounting Brent Fischthal, Michael Cieslinski; Panasonic Factory Solutions Company