26 ami 3.0 results

Method for Automated Nondestructive Analysis of Flip Chip Underfill

Method for Automated Nondestructive Analysis of Flip Chip Underfill

Lead-Free Rework Process For Chip Scale Packages

SMTnet Express - January 10, 2019

widely adopted Sn-3.0Ag-0.5Cu solder alloys for

SMT Express, Volume 2, Issue No. 2 - from SMTnet.com

Alternative Pb-Free Alloys

Alternative Pb-Free Alloys Alternative Pb-Free Alloys While SnAgCu (SAC) alloys still dominate Pb-free selection in North America, especially Sn3.0Ag0.5Cu (SAC305), there are alternative material systems available. Any OEM that is concerned about

SMTnet Express August 29 - 2013, Subscribers: 26233

SMTnet Express - October 2, 2014

International Sn3.0Ag0.5Cu (SAC305) is the most popula

SMTnet Express - November 6, 2014

SMTnet Express - Septemeber 1, 2016

SMTnet Express, Septemeber 1, 2016, Subscribers: 26,288, Companies: 14,937, Users: 41,025 Reliability Study of Low Silver Alloy Solder Pastes Jennifer Nguyen, David Geiger and Murad Kurwa; Flex (Flextronics International) Sn3.0Ag0.5Cu (SAC305