253 ball bonding results

Head-in-Pillow BGA Defects

Head-in-Pillow BGA Defects Head-in-Pillow BGA Defects. Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint

SMT Express, Volume 5, Issue No. 1 - from SMTnet.com

Optimizing Flip Chip Substrate Layout for Assembly

E Newsletter SMT Express

01005 production goes industry wide

3D IC Development Needs Innovative Socket Solution

3D ICs With TSVs - Design Challenges And Requirements

Solder Materials Science Gets Small as Miniaturization Challenges Old Rules

SMTnet Express February 7 - 2013, Subscribers: 26168

, adhesive bonding, coating, and wire bonding. In pa

SMTnet Express - March 18, 2021