1019 bare and boards and aoi results

SMTnet Express - April 21, 2022

SMTnet Express, April 21, 2022, Subscribers: 25,664, Companies: 11,565, Users: 27,188 Deep Learning Based Defect Detection for Solder Joints on Industrial X-Ray Circuit Board Images Quality control is of vital importance during

SMTnet Express - May 6, 2021

SMTnet Express, May 6, 2021, Subscribers: 27,156, Companies: 11,346, Users: 26,625 Deep Learning Based Defect Detection for Solder Joints on Industrial X-Ray Circuit Board Images Quality control is of vital importance during

Three-Dimensional MMIC and Its Evolution to WLCSP Technology

SMTnet Express - April 30, 2020

Reliability Enhancement of Wafer Level Packages with Nano-Column-Like Hollow Solder Ball Structures

Are Separate Solder Flip-Chip Bonders Still Required?

Are Separate Solder Flip-Chip Bonders Still Required? Are Separate Solder Flip-Chip Bonders Still Required? Increasing miniaturization is now encouraging manufacturers of handheld devices to stack bare dies or packages. As the process

SMTnet Express - December 5, 2013

SMTnet Express - November 4, 2021

Strength of Lead-free BGA Spheres in High Speed Loading

SMT Express, Volume 3, Issue No. 4 - from SMTnet.com