SMTnet Express, December 20, 2018, Subscribers: 31,551, Companies: 10,666, Users: 25,526 Process Optimization for Fine Feature Solder Paste Dispensing Credits: Indium Corporation With the rapid trend towards miniaturization in surface mount
SMTnet Express, January 18, 2018, Subscribers: 31,180, Companies: 10,857, Users: 24,296 Fine Pitch Cu Pillar with Bond on Lead (BOL) Assembly Challenges for High Performance Flip Chip Package Nokibul Islam, Vinayak Pandey, KyungOe Kim; STATS Chip
SMTnet Express, December 31, 2015, Subscribers: 23,946, Members: Companies: 14,865, Users: 39,660 Study on Solder Joint Reliability of Fine Pitch CSP Yong Hill Liang, Hank Mao, YongGang Yan, Jindong (King) Lee; AEG, Flex (Flextronics International
Sustaining a Robust Fine Feature Printing Process Sustaining a Robust Fine Feature Printing Process With the introduction of 01005 chip components and 0.3 mm pitch CSP devices, electronic component packaging is pushing surface mount technology
SMTnet Express, August 10, 2017, Subscribers: 30,696, Companies: 10,656, Users: 23,635 High Frequency Electrical Performance and Thermo-Mechanical Reliability of Fine-Pitch, Copper - Metallized Through-Package-Vias (TPVs) in Ultra - thin Glass
SMTnet Express, March 3, 2016, Subscribers: 24,124, Companies: 15,000, Users: 40,059 Nanocopper Based Paste for Solid Copper Via Fill David Ciufo, Sujatha Ramanujan, Janet Heyen, Michael Carmody; Intrinsiq Materials , Sunny Patel; Candor
SMTnet Express, March 10, 2016, Subscribers: 24,118, Companies: 14,735, Users: 39,803 Acceptance Testing Of Low-Ag Reflow Solder Alloys Kris Troxel, Aileen Allen, Elizabeth Elias Benedetto, Rahul Joshi; HP Inc. Since the implementation