Head-in-Pillow BGA Defects Head-in-Pillow BGA Defects. Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint
Conforming To a Higher Standard of Reliability Conforming To a Higher Standard of Reliability An electronic product's reliability has the potential to make or break its manufacturer and can be life-threatening in many safety critical
Conforming To a Higher Standard of Reliability Conforming To a Higher Standard of Reliability An electronic product's reliability has the potential to make or break its manufacturer and can be life-threatening in many safety critical
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