Investigation of Pad Cratering in Large Flip-Chip BGA using Acoustic Emission SMTnet Express January 3, 2013, Subscribers: 26072, Members: Companies: 9076, Users: 34113 Investigation of Pad Cratering in Large Flip-Chip BGA using Acoustic Emission
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Advanced Thermal Interface Materials for Enhanced Flip Chip BGA Advanced Thermal Interface Materials for Enhanced Flip Chip BGA Increased functionality and performance requirements for microprocessors and ASICs have resulted in a trend
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