Single AOI Platform by: Brian D'Amico; MIRTEC Corpora
Brian Graham; Kimball Electronics, Inc. The old t
SMTnet Express, July 7, 2016, Subscribers: 25,539, Companies: 14,860, Users: 40,631 Dissolution of Metal Foils in Common Beverages Bev Christian, Nancy Wang, Mark Pritzker, Daniella Gillanders, Gyubok Baik, Weiyi Zhang, Joanna Litingtun, Brian Kim
SMTnet Express, January 23, 2014, Subscribers: 26486, Members: Companies: 13559, Users: 35667 Testing Intermetallic Fragility on Enig upon Addition of Limitless Cu by Martin K. Anselm, Ph.D. and Brian Roggeman; Universal Instruments Corp
Defect Free QFN Assembly Defect Free QFN Assembly The problem with soldering QFN packages is that they float, skew and tilt on the 'domed' melted solder during the SMT re-flow process. This floating, skewing and/or tilting will lead to solder
SMT Express, Issue No. 3 - from SMTnet.com Volume 1, Issue No. 3 Wednesday, August 18, 1999 Featured Article Return to Front Page Book Review by Brian Ellis Title: A Comprehensive Guide to the Design and Manufacture of Printed Board
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