This cell contains DSP_TRAILER.CFM. This is a layout/formatting test. Eventually, useful content will fill this area.
Optimizing Flip Chip Substrate Layout for Assembly Optimizing Flip Chip Substrate Layout for Assembly High-density flip chip applications are commonly limited by the available substrate technologies. Accordingly, considerable design efforts
SMTnet Express, March 12, 2015, Subscribers: 22,490, Members: Companies: 14,252 , Users: 37,867 Miniaturization with Help of Reduced Component to Component Spacing Jonas Sjoberg, Ranilo Aranda, David Geiger, Anwar Mohammed, Murad Kurwa
