Laser Solder Reflow: A Process Solution, Part 2 Laser Solder Reflow: A Process Solution, Part II EFD, Inc Credit/Source: John Vivari - EFD, Inc. Alex Kasman - LEISTER Technologies LLC EFD Inc. and Leister USA have collaborated to bust
Optimizing Flip Chip Substrate Layout for Assembly Optimizing Flip Chip Substrate Layout for Assembly High-density flip chip applications are commonly limited by the available substrate technologies. Accordingly, considerable design efforts
