Joule Heating Effects on the Current Carrying Capacity of an Organic Substrate for Flip-Chip Applications If you don't see images, please visit online version at: http://www.smtnet.com/express/ News Forums SMT Equipment Company
Investigation of Pad Cratering in Large Flip-Chip BGA using Acoustic Emission SMTnet Express January 3, 2013, Subscribers: 26072, Members: Companies: 9076, Users: 34113 Investigation of Pad Cratering in Large Flip-Chip BGA using Acoustic Emission
