SMTnet Express, May 8, 2014, Subscribers: 22716, Members: Companies: 13872, Users: 36158 Challenges in Bare Die Mounting Larry Gilg, Die Products Consortium Bare die mounting on multi-device substrates has been in use in the microelectronics
Are Separate Solder Flip-Chip Bonders Still Required? Are Separate Solder Flip-Chip Bonders Still Required? Increasing miniaturization is now encouraging manufacturers of handheld devices to stack bare dies or packages. As the process
Imbedded Component/Die Technology (IC/DT®) News Forums SMT Equipment Company Directory Calendar Career Center Advertising About FREE Company Listing! Imbedded Component/Die Technology (IC/DT®) STI has developed a patented
Imbedded Component/Die Technology (IC/DT®) News Forums SMT Equipment Company Directory Calendar Career Center Advertising About FREE Company Listing! Imbedded Component/Die Technology (IC/DT®) STI has developed a patented
