Electrical Performance of an Organic, Z-interconnect, Flip-Chip Substrate Electrical Performance of an Organic, Z-interconnect, Flip-Chip Substrate Endicott Interconnect Technologies Credit/Source: Michael J. Rowlands, Rabindra Das More and more
SMTnet Express April 11, 2013, Subscribers: 26336, Members: Companies: 13353, Users: 34557 No-Clean Flux Residue and Underfill Compatibility Effects on Electrical Reliability by: Todd L Kolmodin, VP Quality; Indium Corporation of America No
We are please to introduce ourself- ，who is one of the SMT solution provider for Global customers, we can supply Automatic Insertion machines spare parts, SMT spare parts, (including feeder ,Nozzle,PCB
Manufacturer / Consultant / Service Provider
The third floor,No 3, Yanghua Road,Huangdong Village ,Fengguang town
Dongguan, 30 China
Phone: zoey@jinchensmt.com
