SMTnet Express, January 8, 2015, Subscribers: 23,708, Members: Companies: 14,158 , Users: 37,476 The Effect of Pb Mixing Levels on Solder Joint Reliability and Failure Mode of Backward Compatible, High Density Ball Grid Array Assemblies Richard
Process optimization -Lead free wave soldering of simple to highly complex boards Process optimization Lead free wave soldering of simple to highly complex boards This research takes an in-depth look at the challenges encountered
