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716 fuji cp642,qp242,x10,nxt parts results

Express Newsletter: fuji cp642

Printed Circuit Board Failure Analysis

Electrical Performance of an Organic, Z-interconnect, Flip-Chip Substrate

Drop Shock Reliability of Lead-Free Alloys – Effect of Micro-Additives

SMT Express, Volume 5, Issue No. 4 - from SMTnet.com

Environmental Compliance Reporting � Mastering a Moving Target

Scaling LCA with IPC-175x

Thermal Cycle Reliability Study of Vapor Phase BGA Solder Joints

SMTnet Express March 14 - 2013, Subscribers: 26245

SMTnet Express August 22 - 2013, Subscribers: 26219

SMTnet Express - March 13, 2014

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