New Methods of Testing PCB Traces Capacity and Fusing New Methods of Testing PCB Traces Capacity and Fusing by: Norocel Codreanu, Radu Bunea, Paul Svasta; "Politehnica" University of Bucharest, Center for Technological Electronics
SMTnet Express, August 1, 2019, Subscribers: 32,197, Companies: 10,845, Users: 24,998 Tin Whiskers: Risks with Lead Free | Part I Credits: ACI Technologies, Inc. Tin (Sn) metal displays the characteristic of growing "tin whiskers" from pure tin
Effects of Tin and Copper Nanotexturization on Tin Whisker Formation SMTnet Express August 17, 2012, Subscribers: 25395, Members: Companies: 8952, Users: 33485 Effects of Tin and Copper Nanotexturization on Tin Whisker Formation First published
SMTnet Express, February 3, 2022, Subscribers: 25,970, Companies: 11,512, Users: 27,043 Next Best Thing to a Close Shave: Mitigating the Risks of Tin Whiskers If you've been in electronics for any length of time, the phenomenon
SMTnet Express August 22, 2013, Subscribers: 26219, Members: Companies: 13462, Users: 35081 Whisker Growth In Tin Alloys On Glass-Epoxy Laminate Studied By Scanning ION Microscopy and Energy-Dispersive X-Ray Spectroscopy by A. Czerwinski, A
SMTnet Express, October 12, 2017, Subscribers: 30,913, Companies: 10,757, Users: 23,915 Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow- Results of an Industry Round-Robin David Pinsky, Tom Hester - Raytheon , Dr. Anduin Touw - The Boeing
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