Handbook Editor: Glenn R. Blackwell Publisher
SMTnet Express, June 29, 2017, Subscribers: 30,527, Companies: 10,624, Users: 23,443 Round Robin of High Frequency Test Methods by IPC-D24C Task Group Glenn Oliver, Jonathan Weldon - DuPont , Chudy Nwachukwu - Isola, John Coonrod - Rogers
Improvement of Organic Packaging Thermal Cycle Performance Measurement Featured Article Improvement of Organic Packaging Thermal Cycle Performance Measurement Endicott Interconnect Technologies Glenn O. Dearing, Paul J. Hart Flip Chip Plastic
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