SMT Express, Volume 4, Issue No. 5 - from SMTnet.com Volume 4, Issue No. 5 Thursday, May 23, 2002 Featured Article Return to Front Page << Back to Page 1 Page 3 >> Knowing the capability coefficients, it is possible to estimate
SMT Express, Volume 5, Issue No. 3 - from SMTnet.com Return to Front Page << Back to Page 1 Page 3 >> Knowing the capability coefficients, it is possible to estimate the defect rate of the measured machine. For example, Cpk = 1
Head-in-Pillow BGA Defects Head-in-Pillow BGA Defects. Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint
SMTnet Express, May 28, 2020, Subscribers: 28,990, Companies: 11,012, Users: 25,834 Head-on-Pillow Defect Detection - X-ray Inspection Limitations Credits: Ericsson AB Both the number and the variants of Ball Grid Array packages (BGAs) are tending
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