Alternative Pb-Free Alloys Alternative Pb-Free Alloys While SnAgCu (SAC) alloys still dominate Pb-free selection in North America, especially Sn3.0Ag0.5Cu (SAC305), there are alternative material systems available. Any OEM that is concerned about
SMTnet Express, January 10, 2019, Subscribers: 31,583, Companies: 10,684, Users: 25,588 An Investigation into Lead-Free Low Silver Cored Solder Wire for Electronics Manufacturing Applications Credits: Koki Company LTD The electronics industry has
Technology (IMPACT) Lab Silver nanowires (Ag NWs) possess
SMTnet Express, June 20, 2019, Subscribers: 32,068, Companies: 10,815, Users: 24,854 Dissolution in Service of the Copper Substrate of Solder Joints Credits: Nihon Superior Co., Ltd. It is well known that during service the layer of Cu6Sn5
Effect of Reflow Profile on SnPb and SnAgCu Solder Joint Shear Force News • Forums • SMT Equipment • Company Directory • Calendar • Career Center • Advertising • About • FREE Company Listing! Effect of Reflow Profile on SnPb and SnAgCu Solder
SnAgCuBi and SnAgCuBiSb solder joint properties investigations SnAgCuBi and SnAgCuBiSb solder joint properties investigations This study investigates the technological properties of quaternary or quinary alloys made by addition Bi or Bi and Sb
SMTnet Express, Septemeber 1, 2016, Subscribers: 26,288, Companies: 14,937, Users: 41,025 Reliability Study of Low Silver Alloy Solder Pastes Jennifer Nguyen, David Geiger and Murad Kurwa; Flex (Flextronics International) Sn3.0Ag0.5Cu (SAC305
SMTnet Express, March 10, 2016, Subscribers: 24,118, Companies: 14,735, Users: 39,803 Acceptance Testing Of Low-Ag Reflow Solder Alloys Kris Troxel, Aileen Allen, Elizabeth Elias Benedetto, Rahul Joshi; HP Inc. Since the implementation
