Express Newsletter: i-pulse new model (Page 1 of 89)

SMTnet Express - April 3, 2014

SMTnet Express, April 3, 2014, Subscribers: 22618, Members: Companies: 13853, Users: 35982 A System Level Electrostatic Discharge Protection Modeling Methodology for Time Domain Analysis. Nicolas Monnereau, Fabrice Caignet, David Trémouilles

SMTnet Express - April 25, 2019

SMTnet Express, April 25, 2019, Subscribers: 31,876, Companies: 10,750, Users: 26,040 The EMS Gateway Model - Local to Global, Seamlessly Credits: ZOLLNER ELECTRONICS, INC. Choosing an outsourced manufacturing partner that is perfect for a new

Method of Modeling Differential Vias

Method of Modeling Differential Vias Method of Modeling Differential Vias Accurate, models for vias in a multilayer circuit board are necessary to predict link performance in the GHz regime. This paper describes a methodology to build a high

SMTnet Express - May 22, 2014

SMTnet Express, May 22, 2014, Subscribers: 22782, Members: Companies: 13894, Users: 36234 Pb-free solders: Comparison of different geometrical models in calculating of enthalpy of mixing of In-Sn-Zn ternary system. A. Boulouiz, M. El Moudane, M

SMTnet Express - December 27, 2019

SMTnet Express, December 27, 2019, Subscribers: 33,251, Companies: 10,949, Users: 25,451 A Life Prediction Model of Multilayered PTH Based on Fatigue Mechanism Credits: Beihang University PTH plays a critical role in PCB reliability. Thermal

SMTnet Express - September 16, 2021

SMTnet Express, September 16, 2021, Subscribers: 26,691, Companies: 11,438, Users: 26,841 Mathematical Model For Dynamic Force Analysis Of Printed Circuit Boards Mathematical model for dynamic force analysis of printed circuit

SMTnet Express June 13 - 2013, Subscribers: 26140

SMTnet Express June 13, 2013, Subscribers: 26140, Members: Companies: 13397, Users: 34803 Electromigration damage mechanics of lead-free solder joints under pulsed DC: A computational model by: Wei Yao, Cemal Basaran; Electronic Packaging

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