3D ICs With TSVs - Design Challenges And Requirements Heat Management in Printed Circuit Boards This report discusses the significance of heat management in the design of printed circuit boards (PCB).After an introduction into the basics of PCBs
SMTnet Express, August 11, 2016, Subscribers: 26,064, Members: Companies: 14,906, Users: 40,872 New Approaches to Develop a Scalable 3D IC Assembly Method Charles G. Woychik Ph.D. Sangil Lee, Ph.D., Scott McGrath, Eric Tosaya and Sitaram Arkalgud
