64 imc cracking results

Investigation of Pad Cratering in Large Flip-Chip BGA using Acoustic Emission

SMT Express, Issue No. 5 - from SMTnet.com

SMTnet Express - May 17, 2018

Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints.

SMTnet Express - December 23, 2015

SMTnet Express, December 23, 2015, Subscribers: 23,927, Members: Companies: 14,845, Users: 39,621 PCB Fabrication Processes and Their Effects on Fine Copper Barrel Cracks Edward Arthur, Charles Busa, Melissa Durfee, Chad Gibson, Wade Goldman P

SMT Express

SMTnet Express - October 24, 2013

SMTnet Express - January 3, 2019

SMTnet Express - October 28, 2021

SMTnet Express, October 28, 2021, Subscribers: 26,544, Companies: 11,461, Users: 26,907 Cracks: The Hidden Defect Cracks in ceramic chip capacitors can be introduced at any process step during surface mount assembly. Thermal shock

The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish