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BGA Rework. A Comparative Study of Selective Solder Paste Deposition For Area Array Packages

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SMTnet Express - September 24, 2015

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SMT Express, Volume 4, Issue No. 3 - from SMTnet.com

The Regulatory and Environment Status of Tetrabromobisphenol-A In Printed Wiring Boards

Reliability of BGA Solder Joints after Re-Balling Process

SMTnet Express September 19 - 2013, Subscribers: 26298

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SMTnet Express - April 27, 2017