SMTnet Express, November 21, 2018, Subscribers: 31,479, Companies: 11,087, Users: 25,424 Understanding the Effect of Different Heating Cycles on Post-Soldering Flux Residues and the Impact on Electrical Performance Brook Sandy-Smith, Indium
SMTnet Express, December 13, 2018, Subscribers: 31,514, Companies: 10,659, Users: 25,503 Assembly Reliability of TSOP/DFN PoP Stack Package Credits: Jet Propulsion Laboratory Numerous 3D stack packaging technologies have been implemented
IPC is the trade association for the printed wiring board and electronics assembly industries.
Training Provider / Events Organizer / Association / Non-Profit
3000 Lakeside Drive, 309 S
Bannockburn, IL USA
Phone: 847-615-7100
