Express Newsletter: ipc-610 d rus (Page 22 of 56)

3D ICs With TSVs - Design Challenges And Requirements

3D ICs With TSVs - Design Challenges And Requirements Heat Management in Printed Circuit Boards This report discusses the significance of heat management in the design of printed circuit boards (PCB).After an introduction into the basics of PCBs

SMTnet Express - September 4, 2014

SMTnet Express, September 4, 2014, Subscribers: 23183, Members: Companies: 14034, Users: 36770 Counterfeit Integrated Circuits: Detection, Avoidance, and the Challenges Ahead. U. Guin, M. Tehranipoor; ECE Department, University of Connecticut, D


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