1084 is fiducial recognition needed with selective soldering results

IPC Printed Circuits Expo APEX

IPC Printed Circuits Expo APEX

SMT Express, Volume 3, Issue No. 7 - from SMTnet.com

A Practical Guide to Achieving Lead-Free Electronics Assembly

SMT Express, Issue No. 5 - from SMTnet.com

Reliability and Failure Mechanisms of Laminate Substrates in a Pb-free World

Reliability and Failure Mechanisms of Laminate Substrates in a Pb-free World

Troubleshooting Shop Floor Rework Difficulties

SMTnet Express January 24 - 2013, Subscribers: 26136

SMTnet Express January 24, 2013, Subscribers: 26136, Members: Companies: 9096, Users: 34208 An investigation into low temperature tin-bismuth and tin-bismuth-silver lead-free alloy solder pastes for electronics manufacturing applications

Optimizing Flip Chip Substrate Layout for Assembly