984 jbc solder iron schematics results

Head-in-Pillow BGA Defects

Head-in-Pillow BGA Defects Head-in-Pillow BGA Defects. Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint

E Newsletter SMT Express

Aiming for High First-pass Yields in a Lead-free Environment

-free soldering, established trends of increasing function

Testing Digital Designs - The Boundary-scan Balance

Using JTAG Emulation for Board-Level Functional Test

Conductive Adhesives: The Way Forward

-free", "no clean" alternative to solder, these high

Tin Whiskering on PCBA Capacitors in Storage (Inside ESD Bag, Inside a Sealed Cardboard Box)

Dispelling 10 Myths About Nitrogen Reflow

Dispelling 10 Myths About Nitrogen Reflow Dispelling 10 Myths About Nitrogen Reflow In my twenty years in the electronics manufacturing industry, I have heard a lot of claims made about the use of nitrogen in inerted soldering processes: many

Matrix Maintenance in PXI with BIRST

Modeling and Control of SMT Manufacturing Lines Using Hybrid Dynamic Systems