85 jianbiao pan results

The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish

SMTnet Express August 29 - 2013, Subscribers: 26233

SMTnet Express August 29, 2013, Subscribers: 26233, Members: Companies: 13474, Users: 35110 Effect of Gold Content on the Microstructural Evolution of SAC305 Solder Joints Under Isothermal Aging by Mike Powers, Jianbiao Pan, Julie Silk, Patrick

Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages

Effect of Reflow Profile on SnPb and SnAgCu Solder Joint Shear Force

Joint Shear Force Heller Industries Jianbiao Pan1,

Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints.

SMTnet Express - January 14, 2016

The Future of Solder Joint Encapsulant

HALT Testing of Backward Soldered BGAs on a Military Product

HALT Testing of Backward Soldered BGAs on a Military Product

SMTnet Express - December 10, 2015