SMTnet Express, July 9, 2015, Subscribers: 23,004, Members: Companies: 14,461 , Users: 38,507 Predicting Fatigue of Solder Joints Subjected to High Number of Power Cycles Craig Hillman, Nathan Blattau; DfR Solutions , Matt Lacy; Advanced Energy
SMTnet Express, July 10, 2014, Subscribers: 22902, Members: Companies: 13928, Users: 36450 Fatigue Damage Behavior of a Surface-mount Electronic Package Under Different Cyclic Applied Loads. Ren Huai-Hui, Wang Xi-Shu - Wind Power Engineer
SMTnet Express, March 7, 2019, Subscribers: 31,716, Companies: 10,725, Users: 25,814 Effect of Encapsulation Materials on Tensile Stress during Thermo-Mechanical Cycling of Pb-Free Solder Joints Credits: DfR Solutions Electronic assemblies use a
SMTnet Express March 21, 2013, Subscribers: 26266, Members: Companies: 13317, Users: 34462 Low Cycle Fatigue Behaviour of Multi-joint Sample in Mechanical Testing by: C.P. Hunt, O. Thomas, D. Di Maio, E. Kamara, H. Lu; National Physical Laboratory
SMTnet Express, August 17, 2017, Subscribers: 30,720, Companies: 10,649, Users: 23,665 The Effect of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability Richard Coyle, Richard Popowich, Charmaine Johnson - Nokia Bell
SMTnet Express, October 17, 2019, Subscribers: 32,268, Companies: 10,900, Users: 25,212 Effect Of Voids On Thermo-Mechanical Reliability of Solder Joints Credits: Alpha Assembly Solutions Despite being a continuous subject of discussion
SMTnet Express, December 31, 2015, Subscribers: 23,946, Members: Companies: 14,865, Users: 39,660 Study on Solder Joint Reliability of Fine Pitch CSP Yong Hill Liang, Hank Mao, YongGang Yan, Jindong (King) Lee; AEG, Flex (Flextronics International
SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Curtailing Voids in Fine Pitch Ball Grid Array Solder Joints by Gary Morrison and Kevin Lyne
